First of all, let’s understand what electroplating is. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of some metals using the principle of electrolysis. It uses electrolysis to attach a metal film to the surface of the metal or other material parts. The process thus plays a role in preventing metal oxidation (such as rust), improving wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.
The common surface coating types of spring thimble are: gold plating, nickel plating, silver plating, chrome plating, zinc plating, copper plating, etc.; different plating materials can meet different application needs, such as those with higher current requirements, generally use surface gold plating treatment As we all know, gold is the metal with the best conductivity at room temperature, followed by silver plating; at the same time, some products are in direct contact with the skin (such as smart bracelets, Bluetooth headsets), and they also need to be protected from sweat and are not sensitized to the skin. And other special requirements (Toplink has mastered this technology and successfully applied it to many products), the requirements for the electroplating layer are even higher. However, the product cost of the relative spring thimble connector will also be higher.
Some products will choose to use conventional electroplating materials such as nickel plating, silver plating, chromium plating, zinc plating, etc. These products are generally larger in size, and the current requirements are not very high, and the cost is relatively low. Generally, such products are selected. Material.
Finally, let's talk about copper plating. The processing material of spring thimble is generally brass, mainly brass with good conductivity and moderate processing hardness. There are some special products that use stainless steel as the main processing material, and copper plating is relatively rare, so I won't explain it in detail here.