In order to meet new requirements, pogo pin products are developing in the direction of small size, narrow pitch and multi-function. In addition, surface mounting, compounding and embedding are also future development directions. The volume and external dimensions of the connector are getting smaller and smaller. The miniaturization of electronic products also requires miniaturization or even more miniaturization of its matching connectors, such as portable handheld digital products such as mobile phones that require more miniaturization of connectors. The number and specifications of contacts in traditional connectors are usually unchanged. If the user needs to change the number and specifications of contacts, other connectors must be used. The emergence of modular connector technology has further solved this problem.
The rapid development of the market has accelerated the technological innovation of connectors, and the design level and processing methods of pogo pins have also been greatly improved. According to industry experts, semiconductor chip technology is gradually becoming the technological driving force for the development of interconnection connectors at all levels. For example, with the rapid development of 0.5 mm pitch chip packaging to 0.25 mm pitch, the number of device pins for the first type of interconnection (inside the IC device) and the second type of interconnection (the interconnection between the device and the board) has increased from hundreds of Increase to thousands. In recent years, fiber optic connectors, USB2.0 high-speed connectors, wired broadband connectors and fine-pitch connectors have been increasingly used in various portable/wireless electronic devices, and even higher-speed USB3.0 has gradually appeared in the market. superior. Therefore, the market application hot spots of the connector are also changing. The electronic process of global enterprises and markets is also getting faster and faster. In the context of the financial crisis, the Chinese government has invested heavily in areas such as triple play, smart grids, automobiles, and rail transit. It can be seen that the market has increasingly higher requirements for high-speed interconnection and current resistance of connectors. As far as consumer electronics is concerned, applications such as Internet TV are popular, and they are related to many antenna applications. TV system manufacturers require antennas to be placed within a small distance.